• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a link unit (100) for high frequency components (20, 30). The linking unit comprises: a housing (130); a first interface (110) and a second interface (120) disposed at the housing and made to be coupled to a high frequency component respectively; an inner conductor (140) extending into the housing, which inner conductor is connected to the first interface (110) and the second interface (120) to establish a high frequency link between the first interface (110) and the second interface (120); a spacer (150) surrounding the inner conductor and extending at least along a portion of the length of the inner conductor. The housing is made from an electrically conductive and rigid material and the spacer is arranged such that the inner conductor (140) is at least partly at a distance from the housing (130).
    公开号:FR3072844A1
    申请号:FR1859758
    申请日:2018-10-23
    公开日:2019-04-26
    发明作者:Christian Arnold；Andreas Wacker；Andreas Fischer；Michael Glasbrenner；Michael Haudum；Florian Essig；Daniel REICHERTER；David Diez；Andreas Scheffel；Patrick Thiemer
    申请人:Tesat Spacecom GmbH and Co KG；
    IPC主号:
    专利说明:

    Field of the present invention
    The present invention relates to the high frequency technique. The present invention relates in particular to a link unit for high frequency devices as well as a high frequency unit and / or a high frequency module equipped with such a link unit. The present invention further relates to a satellite equipped with such a high frequency unit, the high frequency unit can for example be used as part of a communication device and / or of a data transmission section, in particular of a section of transmission by satellites or of a section of radio transmission by satellites.
    Background to the present invention
    High frequency systems are used to transmit signals and data from a transmitting installation to a receiving installation. The high frequency technique is preferred when the data has to be transmitted over a long distance (up to several hundred or several thousand kilometers).
    Before the signals are transmitted to the air interface (for example an antenna), they may for example require processing or preparation. The high frequency technique is for example used on communication satellites to amplify communication signals, combine them and filter them. The high frequency system is often fitted with individual modules (filters, couplers, insulators, preamplifiers, power amplifiers, etc.) linked together.
    The documents EP 2 775 612 A1 and US 9 530 604 B2 describe a signal transmission unit used in the high frequency range and in particular used in a communication satellite.
    Summary of the present invention
    An objective of the present invention may be to provide a connection technique for modular high frequency systems which can be used flexibly.
    This object is achieved because of the subject matter of the independent claim. Other embodiments appear from the dependent claims as well as from the following description.
    According to a first aspect, a link unit for high frequency components is used. The connection unit comprises a casing, a first interface, a second interface, an inner conductor and a spacer. The first interface and the second interface are arranged at the casing and are made so that they can be coupled to a high frequency component respectively. The inner conductor extends into the housing and is connected to the first interface and to the second interface to establish a high frequency link between the first interface and the second interface. The spacer surrounds the inner conductor and extends at least along part of the length of the inner conductor. The housing is made from an electrically conductive and rigid material and the spacer is arranged so that the inner conductor is placed at least in part at a distance from the housing.
    The connection unit described here is mechanically robust, inexpensive, it can be integrated into the existing housings of the high frequency components to be connected, it is light and compact, suitable for low and high input powers as well as '' to direct links and to power distribution and is also suitable for connecting together high frequency components positioned or arranged differently.
    This eliminates coaxial cables or hollow conductors. The connection unit described here is much more rigid and mechanically robust than coaxial cables and is suitable for larger bandwidths than hollow conductors and also offers greater flexibility in terms of layout high frequency components to be connected.
    The two interfaces are preferably arranged at an external surface of the casing and are placed at a certain distance from each other so that the high frequency components to be linked can be connected to each other by means of the link unit.
    The casing is preferably made from a rigid material. This means that the shape of the housing does not essentially change under the influence of its own mass and is also able to support external loads, in particular mechanical loads. The rigid material of the casing can for example be aluminum.
    Since the casing is made from an electrically conductive material, it serves as a screen for the inner conductor, so as to minimize or even eliminate the influence of external electromagnetic fields on the signal transmission via the conductor inside.
    The inner conductor can have a certain own resistance keeping it in a certain defined position inside the casing. The spacer is however present as an additional element for fixing and positioning the inner conductor in the casing. The spacer is made from an electrically insulating material and fixes the inner conductor relative to the housing. The spacer may for example be made in the form of a disc or in the form of a cup and has a recess arranged centrally through which the inner conductor extends. The outer surfaces of the spacer rest against the inner walls of the housing. The spacer preferably rests directly against the interior walls of the housing and with no gap between to prevent movement of the spacer in the housing. The spacer can be made from an elastically deformable material. This can in particular be used to reduce manufacturing and mounting tolerances.
    The inner conductor is coupled to the first and second interfaces. The inner conductor approaches the casing wall at the corresponding coupling points. The inner conductor, however, departs from the walls of the housing at these coupling points.
    In this description, high frequency means a frequency range greater than one GHz (gigahertz, 1 x 10E9 hertz). Such frequency ranges are for example used on sections of radio transmission by satellites. Such a section of radio transmission by satellites may for example take the form of a Ka band transmission section in a frequency range of 17.7 - 21.2 GHz for the downlink section (downlink in English) and 27.5 - 31 GHz for the uplink section (uplink in English), for an implementation of Ku or X band in the 11 and / or 7 GHz range or for an implementation of L band (approximately 1.5 GHz), band S (about 2.5 GHz) or C band (about 4 GHz).
    According to one embodiment, the casing consists of two half-shells connected to each other along a joint point, the casing being at least partly made of aluminum.
    Aluminum is relatively light and has enough strength to protect the bonding unit, especially the inner conductor, from mechanical damage. Aluminum is also electrically conductive, which allows it to serve as an electromagnetic shield for the inner conductor.
    The housing can be composed of two half-shells or in general of at least two hulls joined and connected together to obtain the desired shape of the housing. The half-shells form a hollow chamber through which the inner conductor extends. The inner conductor extends from one interface to the other interface in the hollow chamber of the housing. In this case, the inner conductor can adapt to the shape of the housing. It is for example possible that the curve of the inner conductor is curved or bent. The inner conductor can for example extend so that it has a regular distance from the inner walls of the housing. Alternatively, the inner conductor can extend so that it has the maximum distance from the inner walls of the housing, respectively. This means that the distance of the two opposite interior walls is equal.
    According to another embodiment, the inner conductor consists of an electrically conductive material, the electrically conductive material comprising at least one of the following materials or a combination of these: aluminum, brass, copper, silver, gold.
    The inner conductor is used to transmit high frequency electrical signals. Good electrical conductivity is therefore advantageous for transmitting such signals with the least possible deformation.
    The inner conductor is preferably created from a solid material and is therefore not a hollow conductor.
    According to another embodiment, the inner conductor consists of at least two partial sections connected to each other by means of a connection.
    This division of the inner conductor into several removable partial sections makes it possible to obtain a modular composition of the inner conductor. The angled connections can be created so that it is not necessary to pass a bent inner conductor there.
    According to another embodiment, the connection between the partial sections of the inner conductor is a connection produced by complementarity of forces or by complementarity of friction.
    The connection can thus for example be a connection by clamping or plugging. This has the advantage that in the event of expansion caused by the temperature of the internal conductor or of a relative movement of the interfaces at the level of the casing or of the high frequency components connected to each other, the connection by tightening or plugging makes it possible compensate to some extent for this expansion and / or movement. Alternatively, the connection can also be a screw connection.
    According to another embodiment, a surface of the inner conductor is covered with a layer of silver or gold.
    In other words, the inner conductor is thus silver or gold. This can improve the electrical conductivity. Preferably, the inner conductor is completely covered with silver or gold. The silver or gold layer can be a few pm thick.
    According to another embodiment, the spacer comprises an electrically insulating material.
    The inner conductor is thus electrically isolated and / or separated from the casing. It should be noted that the first and second interfaces are arranged in such a way at the casing and / or are coupled so that the interfaces are electrically isolated from the casing.
    According to another embodiment, the spacer extends over the entire length of the inner conductor and keeps the inner conductor in the casing in a predefined position.
    The purpose of the spacer is therefore to fix the inner conductor relative to the casing and to electrically separate and / or isolate the inner conductor from the casing.
    According to another embodiment, the electrically insulating material of the spacer is a plastic, in particular teflon, a polyetherketone, or a polytetrafluoroethylene.
    These materials have particularly proven themselves in the vacuum field and are therefore advantageous for use on board a satellite operating outside the Earth's atmosphere.
    According to another embodiment, the connection unit further comprises a high frequency component located in the casing and disposed between two sections of the inner conductor as well as electrically connected to these two sections.
    This means that a high frequency component can be integrated in the casing of the link unit to be connected, via the inner conductor, to the other high frequency components arranged outside the casing.
    This high frequency component placed in the casing can for example be a power amplifier electrically connected to two sections of the inner conductor so that respectively one terminal of the power amplifier is guided on an interface of the casing.
    The two sections of the inner conductor are preferably connected to the power amplifier via ribbon lines (microstrips in English). In this case, the sections of the inner conductor are electrically connected to the respective associated ribbon lines.
    This structure has the advantage that the high-frequency component placed in the casing is protected both from external mechanical influences and from electromagnetic fields.
    According to another embodiment, the first interface is a coaxial connector or a hollow conductor and the second interface is also a coaxial connector or a hollow conductor.
    These are therefore external interfaces via which the internal conductor can be coupled to a high frequency component and / or to an interface of the high frequency component.
    The first interface and the second interface can be the same or different. The first interface can for example be a coaxial connection and the second interface can be a hollow conductor connection. This generally means that the first interface and the second interface can respectively be adapted to the high frequency component to be connected. The link unit thus offers a flexible possibility of also connecting high frequency components with different interfaces to each other.
    In another aspect, a high frequency unit is used. The high frequency unit comprises a first high frequency component and a second high frequency component as well as a link unit as described above as well as below, the link unit electrically interconnecting the first component high frequency and the second high frequency component.
    The connection unit can be adapted to the spatial context and the relative arrangement can be adapted to the first high-frequency component and to the second high-frequency component in that the housing of the connection unit is adapted before mounting to requirements of the operating environment.
    According to one embodiment, the first high frequency component is a preamplifier and the second high frequency component is a power amplifier.
    Pre-amplifiers and power amplifiers are preferably used in long distance communication links. The arrangement of preamplifiers and power amplifiers makes it possible to provide a signal in the requested form.
    The high frequency components can also be filters, multiplexers, circulators or insulators which can be linked together using the link unit described here.
    According to another aspect, a satellite is equipped with a high frequency unit, as described above and then thereafter.
    The satellite is a communication satellite. A communications satellite is a spacecraft intended for use in orbit containing a communications facility for receiving and sending data and / or signals. A communication satellite can also contain, in addition, data processing units. The high frequency unit can preferably be used in a signal processing path of the communication installation of the communication satellite.
    Brief description of the figures
    The accompanying drawings will subsequently allow a better understanding of the exemplary embodiments of the present invention. The representations are schematic and are not to scale. Similar references refer to similar items. In the drawings:
    Figure 1 illustrates a schematic isometric representation of a link unit according to an exemplary embodiment.
    FIG. 2 illustrates a schematic representation of an elevation view of a connection unit according to another exemplary embodiment.
    FIG. 3 illustrates a schematic representation of a side view of a connection unit according to another exemplary embodiment.
    FIG. 4 illustrates a schematic representation of a front view of a connection unit according to another exemplary embodiment.
    FIG. 5 illustrates a schematic representation of an elevation view of a connection unit according to another exemplary embodiment.
    FIG. 6 illustrates a schematic representation of a half-shell of a connection unit according to another exemplary embodiment.
    FIG. 7 illustrates a schematic representation of a high frequency unit according to another exemplary embodiment.
    FIG. 8 illustrates a schematic representation of a satellite according to another exemplary embodiment.
    Detailed description of exemplary embodiments
    FIG. 1 illustrates a connection unit 100. The connection unit 100 comprises a casing 130, a first interface 110 and a second interface 120. The first interface and the second interface are arranged at a wall and / or d 'an outer side of the housing 130 and / or are mechanically coupled thereto. The connection unit 100 further comprises an inner conductor 140, the inner conductor 140 extending inside the casing 130 and electrically connecting the first interface 110 to the second interface 120, so that electrical signals can be transmitted from the first interface to the second interface.
    FIG. 1 illustrates in particular that the first interface and the second interface are at the same side and / or on the same surface of the casing 130. It will however be noted that the first interface and the second interface can be on different sides of the housing 130. The location where the first interface and the second interface are in relation to the housing 130 may depend on the location of the high frequency components to be connected together and / or the way in which they are connected between them.
    It will also be noted that the casing 130 can take different external forms. The casing is illustrated in FIG. 1 in the form of a rectangular parallelepiped, but it can also take an L-shape or a U-shape. The casing 130 is made from an electrically conductive material and / or it contains such material. The interior space of the housing 130 is thus protected from electromagnetic fields.
    The inner conductor 140 extends in the casing 130 and is shown in dotted lines in FIG. 1. The inner conductor 140 is electrically and mechanically coupled to the first interface 110 and to the second interface 120. The inner conductor 140 is manufactured metal and / or it includes such a metal, in particular aluminum, brass or copper and can be silver or gold.
    The inner conductor 140 may include several partial sections. In the example of Figure 1, the inner conductor 140 has a first section 142, a second section 144 and a third section 146. These sections are coupled together mechanically as well as electrically. The division of the inner conductor into several sections allows the inner conductor to be composed in a modular fashion. The inner conductor can thus be composed so as to correspond to the shape of the casing 130.
    A connection 143, 145 is respectively provided between the sections 142, 144, 146 of the inner conductor 140. This connection can for example be a connection by plugging, a connection by tightening or a screwed connection. A plug connection and a clamp connection have the particular advantage that they can absorb expansion caused by heat or another movement of the inner conductor 140, of the casing 130 or of the high frequency components to be connected together, since they allow relative movement of the connected sections without breaking or interrupting the electrical connection.
    In a plug connection, the section 142 may for example include a recess (not shown) and the section 144 may include a pin (not shown) inserted in the recess. A screw connection can take a similar structure, the pin being able to be provided with an external thread and the recess being a hole in another section through which the pin is guided. In this case, the spindle is longer than the thickness of the material in the other section, so that a nut can be attached to the external thread of the spindle.
    The first interface 110 and the second interface 120 may for example be arranged and fixed in a bore or in another passage passing through the wall of the casing 130. This is done so that the first interface 110 and the second interface 120 are isolated electrically with respect to the housing 130.
    In other words, the connection unit 100 can be described as follows: the connection unit 100 essentially consists of a metallic outer casing taking the form of a casing 130 which is separate or can be integrated into the housings of existing high frequency components. An inner conductor 140 is guided in this casing 130, this conductor either being held and guided entirely by the spacers 150 (see FIG. 2) or being located at irregular distances from these spacers. The connection of the inner conductor to the microstrip substrates can be made by direct connection (see Figure 5). The connection of the inner conductor 140 to a hollow conductor or to a coaxial connection can occur via the first and the second interface 110, 120. A simple male connector can be placed to connect the coaxial conductors or the coaxial cables. The first interface and the second interface may include a flange at their coupling points with the external high frequency components to be connected and are connected to the high frequency components by plug-in or bond junctions.
    The connection unit 100 is very robust mechanically and the connection of the lying and standing modules is possible without problem. In this case, the link unit is characterized by limited losses notably more reduced than the losses of a cable. The link unit is suitable for the direct link of two high frequency components as well as for the distribution of power from one input to two outputs (see Figure 5). The link unit is thus suitable for modular structures because it allows the connection of many devices in any way. The inner conductor 140 can also be cut at suitable points so as to allow a simple structure (for example junction at the level of the radio components). The sections of the inner conductor can be connected to each other using plug-in or screwed contacts.
    FIG. 2 illustrates an elevation view made on the connection unit 100 from FIG. 1, FIG. 2 illustrating a view of the casing 130. FIG. 2 does not however represent the spacers 150 illustrated in FIG. 1 for visibility reasons.
    The second section 144 of the inner conductor 140 extends from left to right in the longitudinal direction of the casing 130. Two spacers 150 are provided and arranged to hold and fix the inner conductor in a desired position. The two spacers 150 are placed at a certain distance from each other in the longitudinal direction of the second section 144. The spacers 150 ensure that the second section 144 (and / or generally the inner conductor 140) maintain a distance 152 relative to the two opposite side walls 132 of the casing 130. Preferably, the inner conductor 140 is guided centrally between the two side walls 132, that is to say that the distance 152 is identical between the inner conductor and the two side walls.
    It can be seen that the spacers 150 have a width corresponding to the distance between the two opposite lateral walls of the casing 130. The spacers 150 can be made from an elastically deformable material. In this case, the spacers 150 have a greater expansion in the starting state than the distance between the opposite side walls. In a next step, the inner conductor is guided by a recess in the spacer and the spacer is compressed on the side and placed in the housing 130.
    In principle, a spacer may be formed in the form of a disc or in the form of a plate and have a central recess and / or a through passage through which the inner conductor is guided. The contours, that is to say the external shape of the spacer, preferably correspond essentially to a shape of the cross section of the casing 130. The spacers can be arranged at each section of the inner conductor 140 A spacer placed at the level of the first section 142 or of the third section 146 of the inner conductor, however, has a different orientation than the spacer placed at the level of the second section 144.
    Figure 3 illustrates a side view of the representation of Figure 2. The inner conductor is shown in dotted lines. The spacers 150 are illustrated in continuous lines even when they are in side view behind the side wall resting in front of the casing 130.
    The spacers 150 hold the inner conductor so as to maintain the distance 152 between the second section 144 and the bottom wall 134 of the casing 130.
    FIG. 4 illustrates a front view from the left and / or the right with respect to the representations of FIG. 2 and of FIG. 3. For reasons of visibility, only the cross section of the second section 144 of the inner conductor 140 is illustrated in Figure 4. The spacer 150 surrounds the inner conductor 140 and ensures that the inner conductor 140 maintains a desired distance from the side walls, the bottom wall and the ceiling wall of the housing.
    The spacer 150 is illustrated in Figure 4 so that a small distance is seen from the walls of the housing 130. This is only done for visibility purposes. In fact, the spacer 150 rests at least against some of the walls of the casing.
    Even if in FIGS. 2 to 4, the individual spacers 150 are placed at a certain distance from each other, an individual spacer can be provided, this surrounding a large part or all of the inner conductor and being fixed in the casing. One can for example consider that the inner conductor is arranged in the casing and that the inner space of the casing is then poured with a foam or other fluid or malleable material then hardening and thus maintaining the inner conductor in the original position.
    The spacer is electrically insulating and may in particular be a plastic material, for example teflon, a polyetherketone (PEK) or a polytetrafluoroethylene (PTFE, also under the trade name Fluoroloy).
    The inner conductor 140 also requires no additional insulating layer surrounding it directly. The inner conductor can be one or more non-insulated metal rods. The inner conductor can be called cable or wire.
    FIG. 5 illustrates a representation of the link unit 100 in which a high frequency component 170 is provided in the casing 130 and in which the inner conductor is further provided with branching 148.
    The high frequency component 170 can be a power amplifier based on semiconductor elements. The semiconductor elements of the power amplifier 174 are arranged on a plate 172. Electrically conductive strips and / or conductive tracks are located on this plate 172, these strips allowing an electrical connection of the power amplifier 174 to inner conductor. The first section 142 of the inner conductor is electrically connected to the conductive tracks in a joint region 180. These conductive tracks establish an electrical connection between the first section 142 and the power amplifier 174. On the other side, the the power amplifier 174 is also electrically connected to the second section 144 via the conductive tracks, this connection also being made in a joining region 180.
    It can also be seen in Figure 5 that the second section 144 is guided in a branch 148 on the third section 146. The branch 148 can be called T-shaped branch since from the second section 144, two sockets possible signal are made available through the third section 146. Two interfaces at which a signal can be transmitted are illustrated with the references 120A, 120B.
    A connection 145 is provided at the branch 148, this connection possibly describing a connection as mentioned above.
    The power amplifier 174 can also be called terminal stage and / or amplifier terminal stage. A network can be provided at the output of the amplifier terminal stages to combine power based on the technology described. This network can be connected to the other modules or to a transition on the coaxial connector or the hollow conductor to provide a desired interface.
    If terminal stages are used with a power distribution network at the input and output level, the part connected at the input level (preamplifier) and the part connected at the output level (insulation / transition of hollow conductor) remain unchanged. The exchange of terminal floor modules allows the output power to be changed without having to change the other components involved. In these cases, the internal conductor can, for better integration, be divided into several parts and be combined again by means of plugged or screwed connections.
    Instead of the direct power combination at the output (e.g. 4-1 link), each terminal stage can also be guided on a transition of hollow conductor and an insulator (with a 1 -1 link in the link technique described) then the outputs of the insulators are combined, via the power combination, in a network of hollow conductors.
    FIG. 6 illustrates an isometric representation of a half-shell 136 for the casing 130. This half-shell has a U-shape and the inner conductor extends (not shown) through the interior space of the half -shell. A second half-shell has (not shown) the same shape and can for example serve as a cover on the half-shell illustrated to have the housing in a closed form. The edge of the half-shell connected to the second half-shell can be called a joining point or joint edge 137. The two half-hulls can be connected to each other via removable or non-removable connections. For example, it is possible to connect the two demicoques to each other via clicked or clipped connections. It is also possible to connect your half-shells to each other using connections made by the complementarity of materials as long as these connections are suitable for the intended use of the connection unit.
    FIG. 7 illustrates a high frequency unit 10 with a bottom plate 15 and two high frequency components 20, 30 arranged on the bottom plate 15. The two high frequency components 20, 30 are connected to a link unit 100 as mentioned above and described later.
    The high frequency component 20 is mounted so as to rest on the bottom plate 15 and the high frequency component 30 is mounted upright on the bottom plate 15. One reason for this different type of mounting may be that a thermal load higher must be evacuated by the high frequency component 20. Because the high frequency component 20 is mounted with its larger outer surface on the bottom plate 15, it is possible to evacuate a greater share of thermal energy via the thermal pipe in solid bodies, from the high-frequency component 20 to the bottom plate 15. This may be advantageous or even necessary, in particular when used in a vacuum. In comparison, the high frequency component 30 needs to dissipate a reduced amount of heat, so that the high frequency component 30 is mounted upright. This allows the surface of the bottom plate 15 to be used better and more efficiently. The link unit 100 makes it possible to connect the high-frequency components to each other independently of their relative spatial arrangement.
    The mechanical or thermal requirements at the level of the relative device 20, 30 make it possible to determine the necessary position. Devices with high power losses should generally be placed flat and / or horizontally on the mounting surface and / or the bottom plate (to dissipate heat loss power). Devices with lower power losses are placed horizontally or in the second plane, therefore above the high frequency component 20, to save space.
    The casing of the connection unit 100 described here can be mechanically and thermally connected to the casing of the high frequency components to be connected. The connection unit is characterized by lower losses and a flexible configuration of the form of the casing so that in principle any components arranged in any way can be connected together. Ramifications are also possible.
    FIG. 8 illustrates a schematic representation of a satellite 1. A high frequency unit 10 is arranged in the satellite 1. The high frequency unit 10 can be part of a signal transmission path. For example, the high frequency unit 10 is part of a control or signal processing unit for a transmission unit 2, the transmission unit 2 being for example an antenna.
    In addition, it should be noted that "comprising" or "comprising" does not exclude any other element or step and that "one" or "one" does not exclude any plurality. It will also be noted that the characteristics or steps described with reference to one of the previous embodiments or of the previous configurations can also be used in combination with other characteristics or steps of other embodiments or configurations previously described. The references in the claims are not limiting.
    List of references
    Satellite
    Transmission unit, antenna
    High frequency unit
    Baseplate
    First component
    Second component
    100 Link unit
    110 First interface
    120 Second interface
    130 Carter
    132 Side wall
    134 Back wall
    136 Half-hull
    137 Join point, join edge
    140 Inner conductor
    142 Section One
    143 Liaison
    144 Second section
    145 Connection
    146 Third section
    148 Branching
    150 Spacer
    152 Distance
    170 High frequency component
    172 Platinum
    174 Power amplifier
    180 Join region
    权利要求:
    Claims (14)
    [1" id="c-fr-0001]
    claims
    1. Link unit (100) for high frequency components (20, 30), comprising:
    a housing (130);
    a first interface (110) and a second interface (120) arranged at the casing and produced so as to be coupled to a high frequency component respectively;
    an inner conductor (140) extending into the housing, this inner conductor being connected to the first interface (110) and to the second interface (120) to establish a high frequency link between the first interface (110) and the second interface (120);
    a spacer (150) surrounding the inner conductor and extending at least along part of the length of the inner conductor;
    the casing being made from an electrically conductive and rigid material;
    the spacer being arranged so that the inner conductor (140) is located at least in part at a certain distance from the casing (130).
    [2" id="c-fr-0002]
    2. Connection unit (100) according to claim 1, the casing (130) consisting of two half-shells (136) connected together along a joint point (137);
    the casing being at least part aluminum.
    [3" id="c-fr-0003]
    3. Connection unit (100) according to claim 1 or 2, the inner conductor (140) being composed of an electrically conductive material;
    the electrically conductive material comprising at least one of the following materials or a combination thereof: aluminum, brass, copper, silver, gold.
    [4" id="c-fr-0004]
    4. Connection unit (100) according to any one of the preceding claims, the inner conductor (140) consisting of at least two partial sections (142, 144, 146) interconnected by means of a connection (143 , 145).
    [5" id="c-fr-0005]
    5. Connection unit (100) according to claim 4, the connection (143, 144) being a connection produced by complementarity of forces or by complementarity of friction.
    [6" id="c-fr-0006]
    6. Connection unit (100) according to any one of claims 3 to 5, a surface of the inner conductor (140) being covered with a layer of silver or gold.
    [7" id="c-fr-0007]
    7. Connection unit (100) according to any one of the preceding claims, the spacer (150) comprising an electrically insulating material.
    [8" id="c-fr-0008]
    8. Connection unit (100) according to claim 7,
    The spacer (150) extending over the entire length of the inner conductor (140) and holding the inner conductor in the housing (130) at a predefined position.
    [9" id="c-fr-0009]
    9. Connecting unit (100) according to claim 7 or 8, the electrically insulating material of the spacer being a plastic, in particular teflon, a polyetherketone or a polytetrafluoroethylene.
    [10" id="c-fr-0010]
    10. Connection unit (100) according to any one of the preceding claims, further comprising a high frequency component (170) located in the casing (130) and disposed between two sections (142, 144) of the inner conductor as well that electrically connected to these two sections (142, 144).
    [11" id="c-fr-0011]
    11. Connection unit (100) according to any one of the preceding claims, the first interface (110) being a coaxial connector or a hollow conductor;
    the second interface (120) being a coaxial connector or a hollow conductor.
    [12" id="c-fr-0012]
    12. High frequency unit (10), comprising:
    a first high frequency component (20) and a second high frequency component (30);
    a linkage unit (100) according to any one of the preceding claims;
    the link unit (100) electrically connecting the first high frequency component and the second high frequency component to each other.
    [13" id="c-fr-0013]
    13. A high frequency unit (10) according to claim 12, the first high frequency component (20) being a preamplifier and the second high frequency component (30) being a power amplifier.
    [14" id="c-fr-0014]
    14. Satellite (1) equipped with a high frequency unit (10) according to claim 12 or 13.
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    同族专利:
    公开号 | 公开日
    US20190123447A1|2019-04-25|
    DE102017124974B3|2019-02-21|
    FR3072844B1|2022-02-18|
    US10998605B2|2021-05-04|
    DE102017124974B8|2019-05-02|
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    法律状态:
    2019-10-28| PLFP| Fee payment|Year of fee payment: 2 |
    2019-12-27| PLSC| Publication of the preliminary search report|Effective date: 20191227 |
    2020-10-22| PLFP| Fee payment|Year of fee payment: 3 |
    2021-10-21| PLFP| Fee payment|Year of fee payment: 4 |
    优先权:
    申请号 | 申请日 | 专利标题
    DE1020171249745|2017-10-25|
    DE102017124974.5A|DE102017124974B8|2017-10-25|2017-10-25|Connection unit for high frequency devices|
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